Press Release

原文引自： 2020.08.28 數位時代 第316期雜誌《探索5G殺手級應用》by 記者 王郁倫 https://www.bnext.com.tw/article/59024/inventec-5gfactory   (圖片來源：英業達 提供)   自動導向車在工廠內趴趴走不斷線，十條產線的自動光學檢測「功力」相互加乘...打造5G工廠的英業達，不只要自家產線進化，更要做到不同產業的專網解決方案。   台灣第一座5G獨立組網智慧工廠落腳英業達！   2020年8月中，英業達架設起5G企業專網，利用上傳100Mbps及下載1Gbps的高速，串連生產車間上的AOI（自動光學檢測，Automated Optical Inspection）系統，不僅人力安排減少9成，產線直通率（FPY, First Pass Yield）更拉高至85％。   由於人工成本高漲、缺工問題嚴重，以自動化及人工智慧（AI）取代人工，成為大型製造工廠的投資重點。而隨著產品複雜度增高，需要很多工作站接力完成，每一站的不良率相乘，會拉低直通率成績。因此，直通率很常被工廠視為生產線品質優劣的指標。   英業達企業電腦事業群（EBG）總經理蔡枝安說，「我們目標是一分鐘生產一片伺服器主機板。」然而，AOI為了取代人眼檢測，在掃描產品表面後抓出的不良品，有時候卻會因為陰影或反光而誤判，還是必須靠一旁待命員工複檢，將好的產品放回產線，無形中也降低了直通率。 有了5G之後，具備AI的AOI變得更聰明了。   英業達企業電腦事業群總經理蔡枝安表示，用AOI取代人工檢測，減少伺服器產線的9成人力，並提高直通率到85％，終極目標是用機器人在監控室值勤。(圖片來源：數位時代  蔡仁譯攝影) 集10倍圖資雲端學習，「終極目標是機器人在判讀！」   差別在於，AOI告別「單站」智慧，改採「集中」智慧。 AI在學習分辨產品瑕疵時，必須累積足夠多的掃描圖檔，才能精準判讀。5G導入前，每條產線AOI各別利用旁邊的電腦運算判斷，搜集的圖庫也只來自該產線；導入5G後，10條產線AOI，都直接把圖檔上傳雲端集中判斷，數據充足精準度自然提升。 英業達企業電腦事業群全球營運中心副總閻承隆解釋，因為Wi-Fi不穩定，過去智慧工廠每條產線自建AI學習，AOI掃描產品後的圖檔送到產線伺服器運算判別良劣，圖片不夠多精準度就低，要經過不斷學習，精準度才拉高到98％。   但5G專網上路後，AOI掃描的圖檔都能集中送到雲端機房，10條產線收集的圖檔比單條產線多10倍，AOI自然更聰明，安排的產線複檢人員可以銳減，甚至「終極目標是聘機器人在監控室判讀！」 「AOI現在還只是小學生」，10條產線，要排60位員工輪班複檢。一旦5G上路，10條產線只需1～2位工程師監控管理，即使輪3班、排6人，人力還是省下9成。 智慧工廠裡另一項即將連上5G的設備，是自主行走搬料搬貨的「無人搬運車」（AGV, Automated Guided Vehicle）。用Wi-Fi連網時，不但容易斷訊或被蓋台，更麻煩的是，在等待訊號復原的5分鐘裡，失去訊號的AGV早已不知去向。 「5G延遲速度是4G的10分之1。」資深副總陳逸萍說，未來AGV不用靠軌道，就知道前進方向。 5G的高速也有助於伺服器成品測試。過去，伺服器機種少量多樣，測試工作要傳輸的數據動輒高達數G，回傳不夠即時；5G連網後，剛產出的新伺服器若有大量不良品能立即通報，「晚通知，前面產線已經又做一大堆，愈早通知可減少不良品產出。」蔡枝安說。 英業達企業電腦事業群桃園總部8月中完成5G智慧工廠產線，建置核心網路連接機器手臂與AGV車（上圖）及AOI（本文首圖）。(圖片來源：數位時代 蔡仁譯攝影) 從「自用」變身網通大廠，思考不同情境痛點 身為台灣伺服器出貨量龍頭，英業達更看好企業自建5G專網，帶起的電信機房標準化商機，因而加入由電信業主導成立的O-RAN聯盟（5G開放網路架構組織），希望藉此轉型，能如思科、愛立信等網通大廠一樣提供電信級設備。   英業達雲網方案事業部產品開發處經理江智偉分析，藉由自行建置5G工廠，從硬體生產商，轉型為解決方案開發商，研發工程師最大的挑戰，將是如何轉換到使用者立場思考。 畢竟，若要替客戶建置專網，只會開發硬體還不夠，還必須了解不同應用情境的使用者介面，這是影響產品軟體及韌體設計的關鍵。「不同場域的軟體微調（fine tune）重點不同，工廠跟農場就不一樣，如何架構現場環境是英業達不熟之處。」蔡枝安說。 這也是英業達砸3億元，在桃園廠啟動企業專網的關鍵原因。透過5G串連AOI與AGV等設備，不僅驗證打造5G專網能力，檢視自家硬體的表現，也能學如何微調軟體，協助客戶。 下一步，5G專網會全面導入桃園廠，更計畫將解決方案對外銷售。「5G談多了，現在我們可以看到工廠真正帶來的改善程度。」蔡枝安說。 英業達串聯AOI、AGV車的核心網路，串連5G後發揮大連結、超高速率的特性，實現智慧工廠的科技化場景。(圖片來源：數位時代 侯俊偉攝影)

Next-gen data storage server supports dual 2nd Gen Intel Xeon Scalable Processors   TAIPEI, Aug. 14, 2020 — To match an ever-growing need for data storage space, Inventec (2356.TW), one of the key suppliers of world's leading server brands, hyperscale data centers and server system integrators, announced the arrival of Entei - a 2U24Bay Storage Server System to support dual 2nd Gen Intel Xeon Scalable processors. The solution comes with dual-socket 24 LFF HDD Bay in 2U form factor and will allow the scaling of the IoT and cloud industries.   Inventec Entei: 2U24Bay Storage Server System   According to market research by US-based Grand View Research, the size of the global next-generation data storage market is expected to grow at a compound annual growth rate (CAGR) of 12.5% from 2019 to 2025. The growth is driven by increasing global penetration of the IoT in various businesses sectors and industries, where there is an immense need to store multiple forms of data. The research also indicates that market players are currently focusing on the development of scalable, practical and flexible cloud platforms to fulfil the needs of those various businesses and industries in today's rapidly changing digital era.   Inventec Entei: 2U High Serviceability Hybrid Storage Array Entei is powered by dual 2nd Gen Intel Xeon Scalable processors with twelve DIMM capacity (up to 768GB with 64GB DIMMs) in the whole system, laying a new foundation of scalability. Entei also supports Intel Optane persistent memory which capacity is up to 1TB. This enables optimized workload for synergy across computing, network and storage, and provides a higher virtualized workload throughput and number of VM density, a great boost in performance, security, agility and efficiency, while catering to a wide range of key workloads. Ultra-Dense in 2U Form Factor Entei supports 24x 3.5" and 4x 2.5" form factor hot-swappable drives with easy serviceability, providing balanced computing power and storage capacity, flexible I/O expansibility, and hardware redundancy. Together with multiple storage options for greater flexibility and scalability including NVMe support in the rear for a caching layer, Entei also includes 2x M.2 via interposer connection and a variety of storage mezzanine cards. "Entei is an ideal hybrid system for warm storage and is applicable to further storage applications. By optimizing the ratio of SSDs and HDDs, it can highly accelerate IOPS and throughput performance while offering excellent storage capacity. Also, Entei's drawer design for easier drive maintenance is a particular design feature which provides convenience to its users," said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG).   Great Density and Scalability Entei adopts the Intel® C621 chipset, supports dual Intel Xeon Scalable processors, and has up to 768GB of DDR4 memory. Hosting 3 PCIe x16 lanes, enabling expansion of up to 4 PCIe cards (two x8, two x16) with riser boards.   Flexible Network Configuration Lastly, Entei offers an OCP NIC mezzanine option, ranging from 10G Ethernet to 40G (optical or Base-T, compatible with OCP 2.0). This allows high-speed performance and I/O flexibility, catering to suitable demands of different application procedures. Learn more about Inventec Entei: https://ebg.inventec.com/en/product/Storage/2U%2024Bay/Entei     About Inventec Data Center Solutions ( Inventec EBG ) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/ Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.   Inventec logos are trademarks or registered trademarks of Inventec Corporation.Intel, the Intel logo, the Intel Inside logo and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries.

Taipei, July 03, 2020 — Server manufacturer, Inventec (TPE: 2356), today announced that its first edge computing server, E850G4, now supports NVIDIA EGXTM, a high-performance, cloud native platform that brings real-time AI to the edge. As an NGC-Ready for Edge server, the E850G4 is certified for functionality and performance of the GPU Optimized AI stack from NVIDIA, security, and remote management. This 2U GPU server, targets multi-access edge computing (MEC), content acceleration, network-in-a-box, and network function virtualization (NFV) applications, among others, in the booming new market of 5G and edge datacenter. This allows users to rapidly deploy and efficiently run AI workloads in their edge networks. Inventec Announces its NGC-Ready Edge Server Optimized for AI Software-E850G4 NVIDIA EGX Edge AI Platform With the future pointing towards convergence of IoT and AI at the edge, allowing all industries to deliver automated intelligence from billions of sensors at the point of action, a scalable, accelerated platform that can handle continuous delivery of information securely and drive decisions in real time is required. NVIDIA unveiled the latest NVIDIA EGX platform capabilities and NGC features for deploying accelerated AI at the edge and in the data center at GTC Digital in May 2020. NVIDIA EGX platform enables companies to perform low-latency and high performance AI inference at the edge and includes GPU-optimized AI software from NVIDIA NGC -- a registry of containers, pre-trained models, and helm charts along with a private registry that simplify building, collaborating, and deploying AI software securely at the edge. Inventec E850G4:  OTII-based Edge Computing Server The E850G4 server system is encased in a computing box with a NUMA (non-uniform memory access) balanced design for multiple SKUs for acceleration and storage scenarios. This system is also a China Open Telecom IT Infrastructure (OTII) server design for WW5G edge computing applications such as multi-access edge computing, and fog computing. In addition, E850G4 offers enhanced serviceability and reliability including: -   Up to 4x NVIDIA T4 Tensor Core GPUs -   Dual Socket: 2nd Gen Intel® Xeon® scalable processors (Cascade Lake) -  12x DIMM: Up to 1.5TB  3DC ECC DDR4-2933MHz, RDIMM/LRDIMM and Intel® Optane™ DC Persistent Memory (DCPMM) -   Onboard 2x 10G Ethernet port -   Up to 7x PCIe Gen3 slot to support multi-scenarios -   6+(2) SFF SAS/SATA/ NVMe hot-plug drive -    Tool-less design of serviceable parts -    Optimized TCO “Inventec E850G4 supports quality inspection AI cloud and edge applications in industries including 3C electronics, steel plant, energy management, rubber inspection, etc. We designed this new server solution to help our customers optimize their edge infrastructure,” said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG).     Learn more about Inventec E850G4: https://ebg.inventec.com/en/product/Server/2U/E850G4       About Inventec Data Center Solutions ( Inventec EBG ) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/ Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.   Inventec logos are trademarks or registered trademarks of Inventec Corporation. All trademarks and logos are the properties of their respective holders.