Press Release

30 July. 2021
Inventec introduces E200G4, the High-Efficiency AIoT Edge Box
TAIPEI, July 30, 2021  /PRNewswire/ -- Server manufacturer Inventec (TPE: 2356) has unveiled its latest high-efficiency Artificial Intelligence of Things (IoT) Edge box system, the E200G4.                         Outstanding Computing Capability for AI and Edge Applications Inventec introduces AIoT E200G4, the Microsoft Azure certified device.   By 2025, 55.6% of all data will come from IoT devices, including retail devices, industrial equipment, digital signage, medical implants. 11th Gen Intel® Core processors are enhanced for IoT, with this future in mind. A high-performance edge AIoT device, the Inventec E200G4 is backed by an 11th Gen Intel® Core TigerLake-UP3 CPU that supports high performance and reliability for IoT systems and Intel Iris Xe graphics that can decode over 40 video streams at 1080p resolution and 30fps. Excellent Flexibility with Multiple Wireless/AI Modules Inventec E200G4 provides multiple internal M.2 expansion slots and wireless modules, supporting 4GLTE or 5GNR (sub-6G) and WiFi-6 modules for IoT applications or SSD NVMe modules for general storage. The system is equipped with two slots for AI accelerators of up to 70 TOPS. In addition, the E200G4's high-bandwidth network communication capabilities can cater to the demands of different application procedures. 5G Fixed Wireless Access E200G4 supports Fixed Wireless Access (FWA) technology that delivers 5G/LTE broadband services to residential subscribers and enterprise customers. E200G4 is Microsoft Azure certified device, which allows for quick and efficient deployment as an edge device for Microsoft cloud services. A New Software-Driven platform Through a collaboration with Canonical, E200G4 adopts the Ubuntu Linux operation system (OS) with access to the Canonical supported Inventec Store, an app store providing complete control over store content, review processes and identity. E200G4 can also run Canonical's open source NFV stack, designed for hosting VNFs with optimum performance and security requirements, to become an NFVI (Network Functions Virtualization Infrastructure) platform. Industrial-Level System with Wide Operating Temperature Range Highly modular and ultra-thin (8.66 x 1.66 x 6.77 inch), the fan less E200G4 AIoT Box makes maintenance and servicing a breeze. The E200G4 can operate optimally between -20 and 60 Celsius with a wide operating temperature range and 0.7m/s airflow. Its strong environmental adaptability is bolstered by an Ingress Protection rating of 51 in addition to protection standards of IEC 60068-2-64 for vibrations and IEC 60068-2-27 for shocks during operations. The E200G4's sturdy and industry-level system make it perfect for a wide variety of typical IoT applications, including intelligent video surveillance, extensive data analysis, Industry 4.0, and smart healthcare. This is enhanced by Intel Time Coordinated Computing-enabled processors that deliver optimal compute and time performance for real-time IoT applications. "Our long-established relationship with Intel means Inventec constantly offers users Intel-powered industrial performance AIoT with market-leading TCO (total cost of ownership)," said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG). "Our latest AIoT, the E200G4, is an ideal uCPE or edge device for integrated AI acceleration while supporting applications that demand high-speed processing, computer vision, and low-latency deterministic computing," Lin added. About Inventec Data Center Solutions (Inventec EBG) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/en Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.    Inventec logos are trademarks or registered trademarks of Inventec Corporation.  Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.  All trademarks and logos are the properties of their respective holders.  
17 June. 2021
微軟攜手英業達啟動5G智慧工廠策略合作 再創智慧製造轉型新動能
左起為英業達企業電腦事業群總經理蔡枝安、英業達董事長卓桐華、台灣微軟總經理孫基康、台灣微軟物聯網卓越中心副總經理李啓後。     微軟攜手英業達5動5G智慧工廠策略合作 再創智慧製造轉型新動能   整合雙方優勢,以企業專網解決方案樹立代工廠升級新典範   【2021年06月17日,台北訊】疫情加速企業數位轉型步伐,台灣產業紛紛開始採用雲端提升企業靈活、彈性,並以創新技術面對挑戰。為實現智慧製造,台灣微軟與英業達今日宣布簽署合作備忘錄,啟動「Inventec 5G Smart Factory IoT 平台建置計畫」,攜手打造全新 5G 智慧工廠架構,透過微軟旗下以虛擬化運作的雲原生(cloud native 5G private core)網路解決方案 Affirmed Networks,開啟雙方戰略合作,以企業專網解決方案樹立代工廠升級新典範。   英業達成立至今逾 40 年,以筆電、伺服器製造奠定基礎,跨界投入雲端運算、無線通訊及 IoT技術,開啟其製造轉型旅程,非常重視企業創新價值與策略布局,因此 2019 年在其他企業仍受限於傳統 IT 架構時,英業達便成立 5G 研發中心,並於 2020 年開始應用 5G 技術至產線中,藉由實際展現導入 5G 帶來的數據提升、運作成效等實績,化被動服務為主動,搶先掌握客戶需求。英業達董事長卓桐華表示:「此次選擇與微軟旗下的 Affirmed Networks 合作,不僅是看重其在核心網路解決方案上豐富的經驗,更在功能完整性、資安以及與 5G 的連結性上都符合我們的需求。希望雙方合作不只可使英業達改善製程的學習曲線及效率,同時也能樹立產業標竿,進一步協助其他製造大廠建造智慧工廠,開創全新的 5G 智能時代。」   台灣微軟總經理孫基康表示:「全球疫情加速各產業的數位轉型步伐,5G 則是串起『邊緣』和『雲端』的關鍵,然而這項技術能否被靈活應用,須仰賴成熟的通訊生態系統。微軟雲端相關解決方案,將能以更安全且高效的方式為5G生態系統帶來更多創新的服務與體驗。Affirmed Networks 基於雲原生的解決方案,能賦予企業和社會全新機會與視野。英業達的智慧工廠,結合了微軟的雲端平台與英業達的基礎架構完整解決方案,配合 5G 帶來的優勢,打造製造業轉型的解決方案的全新典範。」     軟硬整合雙強者聯手 以創新 5G 與雲端技術構築全新智造工廠願景   身為微軟 Azure IoT 夥伴,英業達透過微軟 5G 專網並採用 Azure 雲端運算,整合軟體虛擬化技術以及開放式硬體概念,建構完全虛擬化、基於 Open-RAN 的 5G 獨立組網企業網。此次英業達與微軟的 Inventec Smart Factory IoT+5G 平台建置計畫合作內容包含:   1. 英業達運用微軟 5G 專網解決方案及 Metaswitch 產品等雲核網技術,搭配微軟 Azure Stack Edge、微軟 Azure 雲端服務與物聯網技術,開發且建置 Industrial Automation Manufacture(工業製造自動化)及 Energy Management Twin(能源管理分身)等 Digital Twins(數位分身)平台,強化並加速英業達產品研發與創新,進一步開發且整合微軟雲端服務。 2. Microsoft Enterprise Skills Initiative 訓練課程,協助英業達強化微軟雲端服務相關技能,並取得相關微軟認證,提升英業達人才專長,加速執行「Inventec Smart Factory IoT + 5G 平台建置計畫」。   英業達雲網方案事業部經理江智偉表示:「英業達智慧工廠最重要的轉型,即是將核心網路轉換為靈活的雲端版本,因此更容易在雲端平台上運作各種應用,開發介面的界接也相對容易與方便,而我們借重 Affirmed Networks 優秀的核心網路解決方案,以及支援 5G 網路需求,發展出有別以往的商業模式。」   台灣微軟物聯網卓越中心副總經理李啓後表示:「雲端部署已是各產業數位轉型的關鍵,微軟持續以創新的雲端及物聯網解決方案,為夥伴生態系擴大資源,此次微軟與英業達建置 Digital Twin 平台,體現英業達智慧工廠在能源等方面的管理,以及微軟幫助企業與社會永續發展的決心,為製造業在 5G 發展的浪潮中穩步邁向數位轉型。」 # # #   關於微軟 微軟(納斯達克上市代碼︰MSFT)致力於發展intelligent cloud與intelligent edge時代的數位轉型,其使命是賦能地球上的每一個人和每一個組織,都能實現更多、成就非凡。   關於英業達 英業達成立以來,從早期製造計算機、電話機,爾後製造筆記型電腦與伺服器,奠定了公司扎實穩固的基礎,締造出傲視全球的佳績。邁入21世紀,更積極投入雲端運算,無線通訊、智能裝置、物聯網等高科技產品的領域,是臺灣前十大製造業及社會責任的標竿企業。                      
08 April. 2021
Inventec unveils new server solution Seadra with 3rd Gen Intel Xeon Scalable Processors
Inventec unveils new server solution Seadra with 3rd Gen Intel Xeon Scalable Processors TAIPEI, April 7, 2021 /PRNewswire/ -- Server manufacturer Inventec (TPE: 2356) is pleased to announce it will deliver new solutions for the latest 3rd Gen Intel Xeon Scalable processors. Inventec Seadra - 3rd Gen Intel Xeon Scalable Processors Inventec Seadra, the 3rd Gen Intel Xeon Scalable processors-based server system, provides a balanced architecture with built-in acceleration and advanced security capabilities which is designed to handle the most in-demand workload requirements.   "Inventec has established a strategic relationship with Intel. We continually provide the best solutions with the optimal TCO and the latest technologies to customers," said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG). "We now roll out a new server—Seadra—a high performance 2U platform that has adopted the latest 3rd Gen Intel Xeon Scalable processors. With built-in AI acceleration, it can help speed data's transformative impact, from multi-cloud to intelligent edge and back."   The 3rd Gen Intel Xeon Scalable Processors   The 3rd Gen Intel Xeon Scalable processors, formerly code-named "Ice Lake," are equipped with 8 to 40 powerful cores in a wide range of features, frequency and power levels. The processors continue to harness and deliver AI acceleration, optimized specifically for the platform's architecture.   The platform is optimized for cloud workloads that support a wide range of Xaas environments. It includes the security-enhancing Intel SGX that allows shared data collaboration without compromising privacy or integrity of data flows. To increase the performance of encryption-intensive workloads, the processors use Intel Crypto Acceleration that includes 5G infrastructure, SSL web serving and VPN firewalls.   Hero features not only include the Intel Software Guard Extensions and crypto enhancements for security, but also the Intel Deep Learning Boost (Vector Neural Network Instructions) for acceleration, the Intel Speed Select Technology for flexibility, gen-to-gen performance improvement for workloads, and the Intel Resource Director Technology for manageability.   Inventec Seadra    Inventec Seadra is a high-performance, highly scalable, efficient and impressive process-based server system. In this latest generation of Intel Xeon Scalable processors, Inventec has yet again delivered an industry-leading, workload-optimized platform suited for those requiring serviceability and reliability without compromising performance.   The highlights of Seadra includes: Ability to accommodate up to 6x PCIe Gen4 x16 slots and 1x OCP 3.0 slot Supports TDP up to 270W Offers high bandwidth network communications capabilities Reduces TCO   Seadra enhances performance by harnessing the 3rd Gen Intel Xeon Scalable processors' built-in AI acceleration. It offers 40 cores, 80 threads and includes up to 8 channels per socket with 2 DIMMs per channel for 32x DDR4 DIMM slots, as well as the support for new Intel Optane persistent memory 200 series modules. .   Seadra is ideal for handling a diverse range of scenarios, including virtualization, hyperconverged storage, cloud computing, and high-end enterprise servers.   About Inventec Data Center Solutions (Inventec EBG) Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients. For more information, please visit: https://ebg.inventec.com/en Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.    Inventec logos are trademarks or registered trademarks of Inventec Corporation.  Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.
24 March. 2021
英業達參加2021智慧城市展 5G智慧工廠解決方案亮相
  綜觀全球製造產業發展趨勢,工業4.0帶動產業智慧生產已成趨勢。隨著5G世代到來,如何透過5G大頻寬(eMBB)、大連結(mMTC)、超低延遲(URLLC)特性,來規劃5G智慧製造,提供產線更敏捷、更彈性的生產能力,是當前製造產業欲積極佈署的商機。     2021智慧城市展23日登場,英業達以5G智慧工廠端對端解決方案為主軸,秀5G技術產品與應用服務,並運用5G的特性來達成工廠自動化的系統整合,展現高效率的5G產線自動化成果。     鎖定5G商機,英業達近年來不斷擴充5G專網系統整合與架構的能力,目標將製造工廠轉型為5G智慧工廠。採用x86標準伺服器,建立全球第一個採用獨立組網(SA)模式、與國際領先級電信業者同等級的開放架構5G ORAN專網,運用在自身的伺服器製造工廠內,不但可以充份降低建置成本與維運複雜度,還可以提供IoT應用場景的可靠連接及資訊安全。     隨著人工成本高漲,產線導入自動化/人工智慧為現今大型製造工廠投資目標。英業達5G AI-AOI端對端解決方案,透過採用開放RAN架構的英業達5G企業專網,在AOI站台,高清的2D與3D掃描影像可透過 5G 回傳至 AI MEC伺服器,得到元件與錯誤位置的資訊,再透過 5G 將影像和分析結果傳到複判站做即時判定,可使元件辨識正確率達到9成以上, SMT(表面黏著技術)產線的基本直通率(FPY, First Pass Yield)提升到85%以上,以節省50%的複判人力,減少10%的設備成本。     英業達期望建置全球智慧製造工廠,結合工業4.0及5G應用,創造更高的生產效率,成為智能製造的領先者。   展覽資訊:2021/03/23-2021/03/26 南港展覽館2館 展位:Q201 
16 March. 2021
Inventec Uses New AMD EPYC™ 7003 Processors to Drive Performance and Value for the Modern Data Center
Inventec Customers Get Breakthrough Performance and Modern Security with New EPYC™ 7003 Series Processors.   TAIPEI, March 15, 2021 -- Server manufacturer Inventec (TPE: 2356) is proud to support AMD, in launching its new AMD EPYC™ 7003 Series processors. During the launch, Inventec is set to unveil its new Horsea server system which is powered by the new processors.   Inventec Horsea- AMD EPYC™ 7003 Processors Powered Server System   AMD EPYC™ 7003 Series Processors   AMD EPYC™ 7003 Series processors offer incredible performance and continue to raise the bar for the modern data center. The processors are based on "Zen 3" core architecture and continue to help businesses deliver faster time-to-value[i]. EPYC™ 7003 Series processors continue to deliver the innovation and technology IT Professionals need with industry leading I/O[ii], 7nm x86 hybrid die core, and the assurance of modern security features.   No new hardware is required with the AMD EPYC™ 7003 Series processors, which are compatible with the AMD EPYC™ 7002 Series processors; a simple BIOS flash update will suffice[iii]. Memory performance is enhanced with the largest available x86 L3 cache, or up to 32MB per core. Added security capabilities are locked down by AMD Infinity Guard technology and a silicon embedded security subsystem, providing top tier security in the cloud and on-prem.   The new EPYC™ 7003 Series processors add to this technology with Secure Encrypted Virtualization - Secure Nested Paging (SEV-SNP), and Secure Encrypted Virtualization - Encrypted State (SEV-ES) memory for enhanced virtualization security[iv].   "AMD EPYC™ 7003 Series processors continue to drive a new standard for the modern data center with fantastic performance, and built-in security features to help defend against attacks to the CPU, applications and data. Building upon the highest per-core performance ever for an x86 data center processor with EPYC 7002 series processor[v], customers can now transform their data center operations to achieve better business results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.   The AMD EPYC™ 7003 Series processors help customers adapt quickly to changing business computing needs.   Inventec Horsea Server   Inventec's Horsea server, the alternative high-performance 2U server system based on dual-socket 7nm AMD EPYC™ 7003 series processors, is applicable to various applications including virtualization, hyperconverged storage, cloud computing and high-end enterprise server.   The features of Horsea include:   Top virtualization solution with optimal TCO and enhanced security Scalability unleashed by latest technology, such as PCIe Gen4 and OCP 3.0 Excellent serviceability and flexibility achieved through modular design   "Inventec is proud to have partnered with AMD. We always try to deliver innovative products that combine the strengths of AMD EPYC™ processors. Horsea is an enhanced performance 2U server based on dual AMD EPYC™ 7003 Series Processors. It is designed for modern software-defined infrastructure, offering a robust and outstanding solution for the new generation workload," said George Lin, General Manager of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG).   About Inventec Data Center Solutions (Inventec EBG)   Inventec Data Center Solutions (Inventec EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems in Inventec Corporation. Over decades, Inventec EBG has been the key server system supplier of the global branding clients.   For more information, please visit: https://ebg.inventec.com/en Follow "Inventec Data Center Solutions" on LinkedIn and Wechat to receive their latest news and announcements.   Inventec logos are trademarks or registered trademarks of Inventec Corporation.   AMD, the AMD arrow logo, EPYC, and combinations thereof are trademarks of Advanced Micro Devices, Inc.   [i] Claims are speculative and are pending testing as of 2/14/2021. Actual claims and claim statements may vary. [ii] Based on processor I/O lanes multiplied by PCIe® bandwidth. PCIe 4 = 16 GB/s link bandwidth vs. PCIe 3 = 8 GB/s. ROM-21 [iii] MLN-001: AMD EPYC™ 7003 Series processors require a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the AMD EPYC™ 7002 Series processors. A motherboard designed at minimum for EPYC 7002 processors is required for EPYC 7003 Series processors. [iv] AMD Infinity Guard security features on EPYC™ processors must be enabled by server OEMs and/or Cloud Service Providers to operate. Check with your OEM or provider to confirm support of these features. Learn more about Infinity Guard at https://www.amd.com/en/technologies/infinity-guard. GD-177 [v] Highest per core performance in the world based on EPYC 7F32 (8-cores) having the highest SPECrate®2017_fp_base score divided by total core count, of all SPEC® publications as of 4/14/2020. 1x EPYC 7F32 (8-cores) scoring 12.875 base result per core (103 SPECrate®2017_fp_base/16 total cores, www.spec.org/cpu2017/results/res2020q2/cpu2017-20200316-21228.pdf) compared to the next highest result 1x AMD EPYC 7262 (8-cores) scoring 11.54 base result per core (92.3 SPECrate®2017_fp_base/8 total cores, http://spec.org/cpu2017/results/res2020q1/cpu2017-20191220-20435.pdf) See www.spec.org/cpu2017/results for full ranking. SPEC® and SPECrate® are trademarks of the Standard Performance Evaluation Corporation. Learn more at www.spec.org ROM-570  
1 2