Press Release

The highly anticipated Open Compute Project (OCP) Global Summit will take place from October 15th to 17th at the San Jose Convention Center (SJCC), bringing together global experts to discuss the latest innovations in open compute, energy efficiency, storage, networking, and security solutions. 

As the largest server motherboard supplier and a leading player in AI server technology, Inventec is committed to leveraging its technical expertise to drive innovation and develop products that make the world a better place. Amid the rapid expansion of artificial intelligence, demand for AI servers, racks, and advanced cooling solutions has reached an all-time high. This year, Inventec will participate in the OCP Global Summit as a Diamond Sponsor, showcasing a comprehensive range of cutting-edge AI servers, racks, and cooling technologies. 

At this year's summit, Inventec will not only demonstrate its exceptional professional capabilities but also emphasize its close work with industry leaders. Notably, Inventec’s strong relationship with NVIDIA will be a key focus. Among the many innovations on display, Inventec will showcase the latest AI rack solution, Artemis, built on the NVIDIA MGX™ modular platform. Powered by the NVIDIA GB200 NVL72 system, the solution features 36 NVIDIA Grace™ CPUs and 72 NVIDIA Blackwell GPUs interconnected via the NVIDIA NVLink™ Switch system, designed to support large-scale generative AI training and inference workloads.  

Additional highlights include a 2U AI server based on the NVIDIA MGX architecture, powered by the NVIDIA GB200 NVL2 platform. Furthermore, the 8U AI server P8000IG6, based on the NVIDIA HGX™ platform, will support the NVIDIA HGX H100, HGX 200, and HGX B200 8-GPU architecture. Another powerful system, the K709G6, will be featured, powered by the NVIDIA Grace CPU Superchip. 

In addition to its NVIDIA®-based systems, Inventec will highlight its collaborations with AMD and Intel. Featured products will include the 8U AI server P8500IG6, which supports both the 4th and 5th Gen Intel Xeon Scalable Processors and the AMD Instinct™ MI300X GPU. Inventec will also display two AI servers, P90G6 and P95G6, built with the 4th and 5th Gen Intel Xeon Scalable Processors and AMD Genoa CPUs, respectively. The 6U AI server Sangria, built on Intel’s platform with Intel Xeon 6 CPUs and Intel Gaudi3 GPUs, will also be featured. These breakthrough platforms are designed to meet the diverse needs of modern workloads 

Moreover, Inventec will introduce its proprietary immersion cooling solution at the summit. The Lambert Rack, a single-node, single-phase immersion cooling system, will be demonstrated. This system offers a total rack thermal design power (TDP) of up to 120KW and is compatible with both silicone oil and hydrocarbon oil, marking a significant leap in immersion cooling technology. 

Visit Inventec at booth B8 to explore these cutting-edge technologies firsthand and engage with our team of experts. We look forward to showcasing how Inventec is driving the future of AI servers and cooling solutions at this year’s OCP Global Summit.