Cold Plate Liquid Cooling

At present, data centers consume approximately 1.5–2% of the world’s electricity, and up to 40% of their electricity consumption goes into cooling. Thus, changing from air cooling systems to liquid cooling systems is paramount. This Inventec closed-loop single-phase cold plate liquid cooling system features a simple design. Without the need for external liquid pipes, it is easy to install. Coolant circulates within a chassis, effectively dissipating heat from components. The heated coolant is then pumped to a heat exchanger located in the chassis, where it releases the heat into the air. This design incorporates a heat exchanger with a large fin surface area to enhance heat transfer performance. In addition, the coolant has a high heat capacity and thermal conductivity, resulting in excellent cooling efficiency. The CPU case temperature in this liquid cooling system is 10–15°C lower compared to that of an air cooling heatsink.

目前資料中心消耗全球約1.5–2%的電力，且其中40%被用於冷卻。因此，將冷卻方式從氣冷改變成液冷非常重要。英業達的閉迴路單相冷板式液冷系統設計簡單，機箱外無需外接液管，安裝方便。冷媒在機箱內循環，將元件的熱帶走。機箱內升溫的冷媒藉由幫浦推動至熱交換機，將熱排放至空氣中。這個設計使用大鰭片面積的熱交換器來增進熱交換率。此外，冷媒具高熱容量與熱傳導性，因而有出色的冷卻效率。在這個液態冷卻系統中，CPU封裝外殼溫度比氣冷式散熱片低了攝氏10–15度。