Inventec Open IP Modular Xeon SP Server is based on Intel 4th Generation Xeon scalable processor. This modular server architecture is suitable for the expansion of emerging edge server systems such as 2U1N/2U2N/2U4N.
Modular server system: Easily to be deployed in different application environments from edge to data center. This modular design can modularize the computing nodes and I/O on the traditional server system, and realize the decoupling of computing nodes and I/O.
Reduced design cost: Reusable modular design shortens time to market, reduces development time, design cost and reduces the carbon footprint of the product.
Deploy application scenario: Inventec Open IP Modular Xeon SP Server can be more flexibly adapted to different application scenarios. The computing node module design can also simply expand the Xeon SP 1-way to 2-way to meet different computing capacity requirements.
Compact Edge server: The modular design board is smaller than the traditional board, and the board with the same computing power can be deployed in the MEC rack/box system as a compact edge server, or as a module in the data center or Outdoor single-phase immersion edge server. In addition, for the immersion system, modularization can better match the characteristics of the coolant and the effect of thermal buoyancy with modular flexible configuration to optimize the cooling capacity of the overall system.