In the past, the amount of data a datacenter could handle was determined by physical space. However, with the rapid growth in data usage demand from cloud, as well as emerging data/computing-intensive workloads, with limitations in power, cooling and spaces, high density rack configuration is how you can best utilize the resources and maximize the compute and data capacity.
Supporting dual processors of latest Intel® Xeon® Scalable Family per node, K900G4 multi-node server solution offers relevant advantages for datacenter rack deployments from lower purchasing cost, smaller footprint, unleashed computing power, energy saving, easy serviceability and management, as well as elastic expandability in its 2U four-node high density enclosure. K900G4 could be easily scaled out to be High Performance Computing (HPC) clusters and fulfill mission critical workloads with optimized TCO. The series presents,
Unleashing Computing Power for HPC Applications :K900G4 is comprised of four high performance nodes, each with dual Intel® Xeon® Scalable Processors, TDP up to 105W, providing high density computing power up to 160 cores and 64 DDR4 DIMM slots, equal to 4TB memory capacity in a single system! Supported by latest Intel® technologies and boosted performance, including 1.5x memory bandwidth and 2x FLOPs capability compared with previous platform, as well as faster socket interconnection through two Intel® UPI channels, K900G4 series is more than capable for HPC and applicable for mission critical workloads.
Sufficient Expandability and Flexible Storage Options : Furthermore, each of K900G4 nodes is equipped with efficient scale-out capacity, providing one standard PCIe x16 slot, offering expandability from a variety of OCP 2.0 NIC card choices.
Regarding to storage configuration, K900G4 onboard supports three drive types, SAS, SATA and NVMe, up to six hot-pluggable drives per node, or 24 drives per system, plus two SATADOM modules per node. Storage RAID is available from a variety of Inventec storage card options.
Optimized TCO with Enhanced Serviceability and Reliability : The 2U4N K900G4 system delivers 4x computing power or 1/4 datacenter footprint compared with traditional 2U1N deployments, lowering the CAPex by high density configurations. To further reduce OPex, with increased reliability and availability, K900G4 supports three dual rotor fans per node, made serviceable on the hot-swappable MLB tray. Together with the hot-pluggable 1+1 power supplies at the rear, the K900G4 system is easily maintainable.
With optimized TCO, K900G4 multi-node high density server system provides the highest efficiency of massive parallel computing for your HPC applications.
Dual Socket per node;Intel® Xeon® processor Scalable family
2U4N rack mount with slide rail
W x H x D: 446 x 86.1 x 787.4 mm (17.56 x 3.39 x 29.43 inch)
16x DDR4 DIMM slot per node;
Up to 64x DDR4 DIMM slot per system